Wafer Level 3-D ICs Process Technology
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
Wafer Level 3-D ICs Process Technology - New York Springer US 2008 - Integrated Circuits and Systems .
978-0-387-76534-1
Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general
Wafer Level 3-D ICs Process Technology - New York Springer US 2008 - Integrated Circuits and Systems .
978-0-387-76534-1
Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general