Normal view MARC view ISBD view

Solder Joint Reliability Prediction for Multiple Environments

Andrew E. Perkins, Suresh K. Sitaraman

Solder Joint Reliability Prediction for Multiple Environments - New York Springer US 2009

ISBN: 978-0-387-79394-8

Subjects--Topical Terms:
Electronics and Microelectronics, Instrumentation; Metallic Materials; Optical and Electronic Materials; Quality Control, Reliability, Safety and Risk

Place hold
Print
Cite
Add to your cart (remove)
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)