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Advanced Materials for Thermal Management of Electronic Packaging

By:

Xingcun Colin Tong

Material type:

TextLanguage: English Series: Springer Series in Advanced MicroelectronicsPublication details: 2011 Springer New York New YorkISBN:

978-1-4419-7759-5

Subject(s):

Electronic Circuits and Devices; Optical and Electronic Materials; Engineering Thermodynamics, Heat and Mass Transfer; Electronics and Microelectronics, Instrumentation

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Holdings
Item type	Current library	Collection	Vol info	URL	Status	Barcode
E-Books	Central Library Central Library	Central Library	30	Link to resource	Available	EB8950

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