TY  - BOOK
AU  - Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
TI  - Wafer Level 3-D ICs Process Technology
SN  - 978-0-387-76534-1
PY  - 2008///
CY  - New York
PB  - Springer US
KW  - Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general
ER  -