Andrew E. Perkins, Suresh K. Sitaraman <br/><br/>
Solder Joint Reliability Prediction for Multiple Environments 

 - New York  Springer US  2009 
<br/><br/><label>ISBN: </label>978-0-387-79394-8 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronics and Microelectronics, Instrumentation; Metallic Materials; Optical and Electronic Materials; Quality Control, Reliability, Safety and Risk