TY  - BOOK
AU  - Andrew E. Perkins, Suresh K. Sitaraman
TI  - Solder Joint Reliability Prediction for Multiple Environments
SN  - 978-0-387-79394-8
PY  - 2009///
CY  - New York
PB  - Springer US
KW  - Electronics and Microelectronics, Instrumentation; Metallic Materials; Optical and Electronic Materials; Quality Control, Reliability, Safety and Risk
ER  -