TY  - BOOK
AU  - Tapan Gupta
TI  - Copper Interconnect Technology
SN  - 978-1-4419-0076-0
PY  - 2009///
CY  - New York
PB  - Springer US
KW  - Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Circuits and Systems; Nanotechnology
ER  -