TY  - BOOK
AU  - Yuan Xie, Jason Cong, Sachin Sapatnekar
TI  - Three Dimensional Integrated Circuit Design
SN  - 978-1-4419-0784-4
PY  - 2010///
CY  - New York
PB  - Springer US
KW  - Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general
ER  -