TY  - BOOK
AU  - Ken Kuang, Franklin Kim, Sean S. Cahill
TI  - RF and Microwave Microelectronics Packaging
SN  - 978-1-4419-0984-8
PY  - 2010///
CY  - New York
PB  - Springer US
KW  - Electronics and Microelectronics, Instrumentation; Microwaves, RF and Optical Engineering; Circuits and Systems
ER  -