TY  - BOOK
AU  - Xingcun Colin Tong
TI  - Advanced Materials for Thermal Management of Electronic Packaging
SN  - 978-1-4419-7759-5
PY  - 2011///
CY  - New York
PB  - Springer New York
KW  - Electronic Circuits and Devices; Optical and Electronic Materials; Engineering Thermodynamics, Heat and Mass Transfer; Electronics and Microelectronics, Instrumentation
ER  -