Tshilidzi Marwala <br/><br/>
Condition Monitoring Using Computational Intelligence Methods 

 - New York  Springer London  2012 
<br/><br/><label>ISBN: </label>978-1-4471-2380-4 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Machinery and Machine Elements; Computational Intelligence; Artificial Intelligence (incl. Robotics); Signal,Image and Speech Processing; Quality Control, Reliability, Safety and Risk; Operating Procedures, Materials Treatment