TY  - BOOK
AU  - Cher Ming Tan, Feifei He
TI  - Electromigration Modeling at Circuit Layout Level
SN  - 978-981-4451-21-5
PY  - 2013///
CY  - New York
PB  - Springer Singapore
KW  - Quality Control, Reliability, Safety and Risk; Electronic Circuits and Devices; Atomic, Molecular, Optical and Plasma Physics
ER  -