TY  - BOOK
AU  - Sujan, D. Dereje, E. Woldemichael. Murthy, M V V. Seetharamu, K N.
TI  - Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
U1  - JNME11-704 
PY  - 2011///
KW  - Effect,Bond,Layer,Bimaterial,Subjected,Uniform,Temperature
ER  -