000			00459nam a2200133Ia 4500
008			231221s9999 xx 000 0 und d
041			_aEnglish
082			_aJNME11-704
100			_aSujan, D. Dereje, E. Woldemichael. Murthy, M V V. Seetharamu, K N.
245		0	_aEffect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
260			_c2011
650			_aEffect,Bond,Layer,Bimaterial,Subjected,Uniform,Temperature
942			_cIR
999			_c230861 _d230861